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High-Speed Board-to-Board Connectors: Driving the Next Generation of High-Speed Connectivity in 2025
As AI computing, 5G communication, industrial automation, and edge servers continue to evolve, the demand for high-speed data transmission keeps accelerating. Among the most critical components enabling these technologies are high-speed board-to-board connectors, which play a central role in ensuring stable, high-density, and reliable signal connections between circuit boards.
Tzyr Hwey Enterprise Co., Ltd., a leading Taiwan-based manufacturer with over 30 years of experience in electronic connector design and production, is dedicated to providing high-bandwidth, high-reliability, and customized interconnect solutions that meet the growing demands of modern high-speed systems.
• AI servers and data centers
• 5G base stations and networking equipment
• Industrial computers and automation systems
• Automotive electronics and ADAS modules
• Medical imaging and consumer devices
In these applications, designers increasingly focus on signal integrity (SI), EMI shielding, high-speed differential pair matching, and mechanical robustness to ensure long-term performance and reliability.
Modern high-speed connectors have advanced from 10 Gbps to 56 Gbps PAM4, and are now moving toward 112 Gbps to support next-generation standards such as PCIe Gen5/Gen6, CXL, and Ethernet.
2) Miniaturization and High-Density Design
As devices become smaller, connectors are trending toward fine-pitch designs (0.5 mm, 0.4 mm) while maintaining excellent mechanical durability and assembly reliability.
3) Low-Loss Materials and SI Optimization
To ensure superior signal integrity, manufacturers are adopting low-dielectric constant materials (Low Dk/Df), gold-plated contacts, and differential signal shielding structures to minimize insertion loss and crosstalk.
4) Flexible Stacking Configurations
High-speed board-to-board connectors offer versatile stacking heights (e.g., 5 mm–20 mm) and configurations including vertical, right-angle, and mezzanine types, enabling flexible PCB layouts in compact systems.
Tzyr Hwey Enterprise is actively expanding its product lines to support MCIO, PCIe Gen5/Gen6, and high-speed industrial interface standards, offering customers comprehensive solutions from design and prototyping to mass production.
✔️ Certified with ISO 9001 and ISO 14001 quality systems
✔️ Strong engineering and customization capabilities
✔️ High-precision tooling and plastic injection processes
✔️ Market coverage across industrial, communication, automotive, and medical sectors
Driven by the mission 'Connecting the World, Always Online,' Tzyr Hwey continues to innovate and deliver high-speed, high-reliability connector solutions to global customers.
Tzyr Hwey Enterprise Co., Ltd., a leading Taiwan-based manufacturer with over 30 years of experience in electronic connector design and production, is dedicated to providing high-bandwidth, high-reliability, and customized interconnect solutions that meet the growing demands of modern high-speed systems.
1. The Role and Applications of Board-to-Board Connectors
Board-to-board connectors are used to transmit signals and power between two printed circuit boards (PCBs). They feature compact design, short transmission paths, and excellent stability. As electronic systems move toward higher speeds and greater integration, these connectors have become indispensable in industries such as:• AI servers and data centers
• 5G base stations and networking equipment
• Industrial computers and automation systems
• Automotive electronics and ADAS modules
• Medical imaging and consumer devices
In these applications, designers increasingly focus on signal integrity (SI), EMI shielding, high-speed differential pair matching, and mechanical robustness to ensure long-term performance and reliability.
2. Key Development Trends of High-Speed Board-to-Board Connectors
1) Higher Transmission SpeedsModern high-speed connectors have advanced from 10 Gbps to 56 Gbps PAM4, and are now moving toward 112 Gbps to support next-generation standards such as PCIe Gen5/Gen6, CXL, and Ethernet.
2) Miniaturization and High-Density Design
As devices become smaller, connectors are trending toward fine-pitch designs (0.5 mm, 0.4 mm) while maintaining excellent mechanical durability and assembly reliability.
3) Low-Loss Materials and SI Optimization
To ensure superior signal integrity, manufacturers are adopting low-dielectric constant materials (Low Dk/Df), gold-plated contacts, and differential signal shielding structures to minimize insertion loss and crosstalk.
4) Flexible Stacking Configurations
High-speed board-to-board connectors offer versatile stacking heights (e.g., 5 mm–20 mm) and configurations including vertical, right-angle, and mezzanine types, enabling flexible PCB layouts in compact systems.
3. Market Outlook
According to industry research, the global high-speed connector market is expected to grow at a compound annual growth rate (CAGR) of over 10% in the coming years. AI servers and data centers will be the main growth drivers. With the increasing adoption of Open Compute Project (OCP) standards and modular system architectures, future designs will emphasize standardization, scalability, and interoperability.Tzyr Hwey Enterprise is actively expanding its product lines to support MCIO, PCIe Gen5/Gen6, and high-speed industrial interface standards, offering customers comprehensive solutions from design and prototyping to mass production.
4. Tzyr Hwey Enterprise Advantages
✔️ Over 30 years of experience in connector design and manufacturing✔️ Certified with ISO 9001 and ISO 14001 quality systems
✔️ Strong engineering and customization capabilities
✔️ High-precision tooling and plastic injection processes
✔️ Market coverage across industrial, communication, automotive, and medical sectors
Driven by the mission 'Connecting the World, Always Online,' Tzyr Hwey continues to innovate and deliver high-speed, high-reliability connector solutions to global customers.